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DIFFUSION BONDING

Join similar and dissimilar metals

Interminglement with the atoms of two metallic surfaces over time under elevated temperature

Solid-state bonding

ALUMINUM

COPPER

STAINLESS STEEL

Various metal bonding

Similar and dissimilar metals

High temperature and pressure

Bonding

Specifications

Diffusion bonding

Material|Aluminum / Copper / Stainless steel etc.

Characteristics|No Flier / Similar bond strength with basic metals / 3D microchannel manufacture available / Small production

Application|Microchannel Heat exchanger, Cooling Plate, 3D Cooing channel of mold (For more information, contact us.)

ARITOUS CORPORATION|Tel +82 51 611 0651|Fax +82 51 611 0652|aritous@aritous.com

B/D #8, 1st Floor, Sinseon-ro 365, Nam-gu, Busan, Republic of KOREA (48547)
ⓒ 2016. ARITOUS Corp. all right reserved.

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